Справочник. — М.: Радио и связь, 1991. — 529 с. — ISBN 5-256-00699-1. Рассмотрены механические, химические, ионные, плазменные, электронно-лучевые и другие методы обработки в технологии микроэлектронных устройств. Обобщены данные по выращиванию монокристаллов, диффузии, эпитаксии, ионной имплантации, технологии тонких пленок, литографии, сборке и герметизации. Значительное...
2nd Edition. — Noyes Publications, 1998. — 599 p. — (Materials Science and Process Technology Series). — ISBN: 0-8155-1423-9. The hybrid microcircuit is, in essence, an electronic packaging and interconnection approach that assures low weight, small volume, and high density. Hybrid circuits are thus used for the most demanding applications including manned spacecraft, heart...
2nd edition. — NASA, 1966. — 327 p. — (NASA Parts Publication NPC 275-1). This is the second edition of the Microelectronic Device Data Handbook, prepared under National Aeronautics and Space Administration Contract NASW 1250. It supersedes the first edition, NASA Parts Publication NPC 275-1, published in March 1964. Handbook provides general guidance to the technology of...
Westwood: Noyes Publications, 1993. — 634 p. — (Materials Science And Process Technology Series). The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices, especially advanced ULSI silicon circuits, A considerable body of technical and scientific literature has been published on this important subject;...
2nd edition. — William Andrew, 2008. — 660 p. The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps...
2nd edition. — Noyes Publications/William Andrew, 2001. — 1022 p.
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist coatings, including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process...
Правила для деталей поверхностного монтажа (SMT). Подробно и в картинках описано и показано, как необходимо правильно необходимо выполнять работу. Показаны примеры.
Содержание.
Soldering Joint Criteria Page
Screen or Stencil Printing of Solder Paste
Placement Accuracy
Visual inspection of soldered joints
Guidelines for Footprint Design Page
Footprint design for Discrete...
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