Keser Beth, Kroehnert Steffen (ред.) Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

USA: Wiley, 2019. — 564 p.Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.List of ContributorsHistory of Embedded and Fan‐Out Packaging Technology
FO‐WLP Market and Technology Trends
Embedded Wafer‐Level Ball Grid Array (eWLB) Packaging Technology Platform
Ultrathin 3D FO‐WLP eWLB‐PoP (Embedded Wafer‐Level Ball Grid Array‐Package‐on‐Package) Technology
NEPES’ Fan‐Out Packaging Technology from Single die, SiP to Panel‐Level Packaging
M‐Series Fan‐Out with Adaptive Patterning
SWIFTR Semiconductor Packaging Technology
Embedded Silicon Fan‐Out (eSiFOR) Technology for Wafer‐Level System Integration
Embedding of Active and Passive Devices by Using an Embedded Interposer: The i2 Board Technology
Embedding of Power Electronic Components: The Smart p2 Pack Technology
Embedded Die in Substrate (Panel‐Level) Packaging Technology
Blade: A Chip‐First Embedded Technology for Power Packaging
The Role of Liquid Molding Compounds in the Success of Fan‐Out Wafer‐Level Packaging Technology
Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan‐Out Wafer‐Level Packaging (FO‐WLP)
Enabling Low Temperature Cure Dielectrics for Advanced Wafer‐Level Packaging
The Role of Pick and Place in Fan‐Out Wafer‐Level Packaging
Process and Equipment for eWLB: Chip Embedding by Molding
Tools for Fan‐Out Wafer‐Level Package Processing
Equipment and Process for eWLB: Required PVD/Sputter Solutions
Excimer Laser Ablation for the Patterning of Ultra‐fine Routings
Temporary Carrier Technologies for eWLB and RDL‐First Fan‐Out Wafer‐Level Packages
Encapsulated Wafer‐Level Package Technology (eWLCSP): Robust WLCSP Reliability with Sidewall Protection
Embedded Multi‐die Interconnect Bridge (EMIB): A Localized, High Density, High Bandwidth Packaging Interconnect
Interconnection Technology Innovations in 2.5D Integrated Electronic Systems