Russ S.H. Signal Integrity: Applied Electromagnetics and Professional Practice

New York: Springer, 2016. — 182 p. — ISBN: 978-3-319-29758-3.This textbook teaches how to design working systems at very high frequencies. It is designed to introduce computer engineers to the design of extremely high speed digital systems. Combining an intuitive, physics-based approach to electromagnetics with a focus on solving realistic problems, the author presents concepts that are essential for computer and electrical engineers today. The book emphasizes an intuitive approach to electromagnetics, and then uses this foundation to show the reader how both physical phenomena can cause signals to propagate incorrectly; and how to solve commonly encountered issues. Emphasis is placed on real problems that the author has encountered in his professional career, integrating problem-solving strategies and real signal-integrity case studies throughout the presentation. Students are challenged to think about managing complex design projects and implementing successful engineering and manufacturing processes. Each chapter includes exercises to test concepts introduced.The Basics: Charge, Energy, Time, and Distance.
Background and Objectives.
Getting Back to Basics.
Consequences of the Basics.
Distance, Time, Speed, and c.
The Effect of Dielectrics.
Risetime.
Lumped Versus Distributed.
Combining Risetimes.
Knee Frequency.
Homework.Practical Matters: Circuit Boards and Debugging.
Background and Objectives.
Components and Component Packages.
What Is a Circuit Board?
How Are Circuit Boards Made?
How Are Circuit Boards Used to Make a Product?
Backup: How Did We Get Here?
How Are Circuit Boards Designed?
The Board Is Dead. Now What?
Homework.Gates, Packaging, and Boards: Properties and Modeling.
Background and Objectives.
What Limits What Is Possible?
Power and Heat Dissipation.
Summarizing the Effects.
Simplest Gate Model.
Electrical Modeling.
The Modeling Process.
The Limits of Modeling.
Homework.Circuit Elements: Resistance, Capacitance, and Inductance.
Background and Objectives.
Reviewing the Review.
What Is Resistance?
What Is Capacitance?
Finding Capacitance.
What Is Inductance?
Calculating Inductance.
Inductance and Return Current.
Inductance and the Skin Effect.
Homework.Ground Bounce and Ringing.
Background and Objectives.
The Role of Inductance.
What Is Ground Bounce?
Results of Ground Bounce.
Minimizing Ground Bounce.
What Is Ringing?
Results of Ringing.
Minimizing Ringing.
So Where Is Ringing Seen and Not Seen Today?
Homework.Distributed Analysis: Transmission Lines, Z₀, Reflections, and Termination.
Background and Objectives.
Where Can You See a Transmission Line?
Transmission Line: The View from the Inside.
Estimating Z₀ in Common Situations.
Approximate Model of a Transmission Line.
The Left Hand and the Right Hand: Reflection and Transmission.
Terminating Impedance.
Departures from the Ideal.
Fixing It When It’s Broke.
Engineer’s Notebook: The High-Speed Bus Disaster.
Homework.Lossy Transmission Lines.
Background and Objectives.
What Is Attenuation and How Is It Measured?
Frequency-Dependent Attenuation.
Dielectric Loss.
How Does Dielectric Loss Affect ε?
How Does Dielectric Loss Affect Signal Propagation?
Homework.Differential Signaling.
Background and Objectives.
What Is Differential Signaling and How Does It Help?
What Is Z_diff?
Obstacles: Clock Jitter and Common-Mode Signals.
Termination Strategies Revisited.
Homework.Crosstalk.
Background and Objectives.
What Is Crosstalk?
Near-End Versus Far-End Crosstalk.
Estimating and Reducing Crosstalk.
Diagnosing Crosstalk.
Homework.Power Distribution Network: Frequency Domain Analysis.
Background and Objectives.
The Power Distribution Network.
Power Supplies and Resonance.
Design Strategy: The Big Picture.
Design Strategy: The Details.
Design Strategy: The Role of Simulation.
Selecting Bypass Capacitors.
Homework.EMI/EMC: Design and Susceptibility.
Background and Objectives.
EMI/EMC.
Circuit-Board Design.
Chassis.
Cabling.
Legal Certification: Standards and Test Requirements.
Homework.Electrostatic Discharge.
Background and Objectives.
What Is Electrostatic Discharge?
Where Can ESD Occur?
ESD and Lightning Standards and Testing.
Components to Manage ESD.
Design Techniques to Manage ESD.
Homework.Clocks, Jitter, and Phased-Lock Loops.
Background and Objectives.
Clock Jitter and Clock Skew.
Clock Sources.
Origins of Clock Jitter and Layout to Reduce It.
Engineer’s Notebook: The Crystal Layout.
Homework.More Practical Matters: Testing, Debugging, DFX, and Quality Management.
Background and Objectives.
Testing a Board: The Oscilloscope.
Debugging a Board: Overview.
Transitioning to Mass Production.
Engineer’s Notebook: Confusing Connectors.
Engineer’s Notebook: Factory Fire.
Homework.Practical Matters III: Commercial and Legal Implications, Project Management, and Risk Mitigation.
Background and Objectives.
Legal Aspects of Design.
Commercial Aspects of Design.
Engineering Notebook: Predicting What Comes Next.
Project Management.
Risk Mitigation.
Engineering Careers.
Homework.